Facilities |
E-beam pattern generator ZBA21 (Carl-Zeiss, Jena, Germany), 20 keV, variable shaped beam (100×100 nm2 - 6.3×6.3 µm2 shot size), 3-6 inch substrates size, small samples possibility, multilevel technology, updated by Vistec, Ltd., Jena, Germany Control system NanoMaker (Interface, Ltd.) for SEM based lithograpy Photolithography (JUB 2104.16, Germany) Resist processing resist spinners (Convac), resist processor (APT 915), substrate cleaner (Ultratech), wet bench, resist stripping, Demi water station (W.Werner) Data Processing CAD software for data preparation PC IBM compatible, GDSII to DXF compilator |
Inspection and Measurement Optical microscopes (Jenatech, Carl-Zeiss, Jena, Germany)
Linewidth measurements SEM (BS-340, Tesla, Brno, Czech Republic)
High-resolution inspection FE SEM (S-800, Hitachi, Japan)
Mask registration mask comparator (SVG160, Carl-Zeiss, Jena, Germany)
Thin film thickness measurements
Ellipsometer Thin film deposition magnetron sputtering (SCM 600, Alcatel) Clean rooms Class 1000 |
Collaboration in facilities Deep-UV lithography Institute of Electrical Engineering, Slovak Academy od Sciences, Bratislavawww.elu.sav.sk Dry etching Institute of Electrical Engineering, Slovak Academy od Sciences, Bratislavawww.elu.sav.sk SEM Department of Experimental Physics, Fakulty of mathematics, physics and informatics, Comenius University, Bratislavawww.dep.fmph.uniba.sk IBE Biont, a.s., Bratislavawww.biont.sk |
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